Xu Chen, Jun Zhang, Z.P. Wang, Microscopic observation of failure mechanism of anisotropic conductive adhesive film for flip-chip joining. Inter Society Conference on Thermal Phenomena, Itherm2004, p 453-457.（EI收录）
Xu Chen, Jun Zhang, Bonding parameters of anisotropic conductive adhesive film and peeling strength. Asian Pacific Conference for Fracture and Strength '04, APCFS04 Jeju Island, Korea, 6-8 Oct., 2004, Key Engineering Materials, 2005, Vol.297-300, p918-926.（EI收录）
Xu Chen, Jun Zhang, Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection. Microelectronics Reliability, Vol.46, 2005, p 774-785.（SCI收录）
Jun Zhang, Xu Chen, Xinli Wei, Numerical Caculation of Peeling Strenght in Anisotropic Conductive Adhesive Bongding. Key Engineering Materials Vol. 324, 2006, p 471-475.（EI收录）
Jun Zhang, Xu Chen, Xinli Wei, Yongcheng Lin, The mechanisms analysis of the ACF bonding strength after the environment test, 2006 APCFS conference, 2006.11: 17-0233. （EI收录）
Jun Zhang, Y.C. LIN, Liugang Huang, The Effect of the Different Teflon Films on Anisotropic Conductive Adhesive Film (ACF) Bonding, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.（EI收录）
Jun Zhang, Xu Chen, Xinli Wei, and Yong-Cheng Lin，Interfacial Stresses Analyses of Anisotropic Conductive Adhesive Bondig Under Thermal and Humidity Loads, Journal of Computational and Theoretical Nanoscience，Vol. 5,(2008) 1542-1545.（SCI收录）
Y.C. Lin , Jun Zhang, Jue Zhong, Application of neural networks to predict the elevated temperature flow behavior of a low alloy steel, Computational Materials Science 43 (2008) 752-758.（SCI收录）
Jun Zhang, Yong-cheng Lin, Xin-li Wei, Liu-gang Huang. Investigation on Interfacial Bonding Strength of Anisotropic Conducive Adhesive with a New Cohesive Zone Model, Materials Science Forum, Vols. 654-656 (2010),pp 1928-1931. （EI收录）
Jun ZHANG, Zhongyao ZHAO, Xinli WEI. A Damage Cohesive Model for Simulating 90o Peel Propagation in Anisotropic Conducive Adhesive Bonding. Advanced Materials Research, Vols. 139-141 (2010), pp 374-377（EI收录）
Jun ZHANG, Xin-yan HE, Xin-li WEI. An Automatic Shake Mechanism for the Biomass Pyrolysis Feeding. Advanced Materials Research, Vols. 97-101 (2010) pp 2314-2317（EI收录）
Jun Zhang, zhen-wei Yuan, Xin-lin WEI. An Automatic Shake Mechanism for the Biomass Pyrolysis Feeding. Powder Technology, Vols. 207(2011), pp 348-352（SCI）
Jun Zhang, Yang Li, Xin-li Wei. Analyses of Interfacial Thermal Stresses for DLC/WC-co. Advanced Materials Research,Vols. 189-193 (2011),pp 3870-3873. (EI)
Zhang Jun, Teng Wenrui, Wei Xinli, Energy optimization of biomass pyrolysis and liquefaction system in CFB, 2011 International Conference on Computer Distributed Control and Intelligent Environmental Monitoring, 2011, pp190-193. (978-0-7695-4350-5/11 $26.00 ? 2011 IEEE DOI 10.1109/CDCIEM.2011.456) (EI)
Jun Zhang, Yamei Geng, Liugang Huang. Analysis of Electrical Characteristics for Conductive Particle in Anisotropic Conductive Adhesive Film (ACF) Assembly. Lecture Notes in Electrical Engineering, 1, Volume 86, Future Intelligent Information Systems, 2011, pp 247-253 (EI)
Shi Lei、Zhang Jun、Ma Xinling、Wei Xinli，AStudyoftheHeatPipesEquippedHeatExchangerThat Worksinthe Saturated Humid Air，The 6th International Symposium on Heating, 6TH INTERNATIONAL SYMPOSIUM ON HEATING, VENTILATING AND AIR CONDITIONING, VOL I-III, PROCEEDINGS: 1865-1873: 2009（ISTP收录）
Y. C. Lin, Xu Chen, Jun Zhang, Behavior of anisotropic conductive joints under hygrothermal conditions,2006 APCFS conference, 2006.11: 17-0771.（EI收录）
Y.C. Lin, Jing-Hong Lu, Jun Zhang. Numerical simulation for the Thermal Fatigue of Flip Chip Solder Joints. Advanced Materials Research. Vols. 97-101 (2010), pp 3963-3966. （EI收录）
Y.C. Lin, Ming-Song Chen, Jun Zhang. Effects of Forging Processing Parameters on Axial Effective Strain in Heavy Forgings. Materials Science Forum, Vols. 654-656 (2010), pp 1618-1621. （EI收录）、
Y.C. Lin, Xiao-Min Chen, Jun Zhang, Uniaxial ratchetting behavior of anisotropic conductive adhesive film under cyclic tension，Polymer Testing 30 (2010) 8–15（SCI）
张军，陈旭，各向异性导电胶粘接可靠性研究进展，电子元件和材料，2004, Vol. 23, p 35-38. (核心期刊)
张军，陈旭，贾宏，粘接界面的损伤研究, 郑州大学学报, Vol. 27, 2006, p 48-51. (核心期刊)
张军，贾宏，环境对各向异性导电胶的性能参数的影响, 电子与封装, Vol. 6, 2006, p 33-36.
贾宏，张军，黄刘刚， 薄板粘接结构的界面力学模型与数值模拟,科技导报, Vol. 26, 2008, p 64-67
贾宏，张军，王定标，高温高湿下各向异性导电胶粘接界面的受力分析，郑州大学学报, Vol. 29, 2008, p 81-84. (核心期刊)
张军，高希培，贺心燕，魏新利，生物质热解液化装置结焦成因及除结焦研究，林业机械与木工设备，2008,Vol 36, No 10：16-18。(核心期刊)